The N32WB452 series MCUs feature a dual-core architecture with a 32-bit Arm® Cortex®-M4F and Arm® Cortex®-M0. They support single-cycle hardware multiplication and division instructions, DSP instructions, and MPU. The MCUs have built-in Bluetooth BLE5.0 RF with TX/RX power consumption of 3.6mA/3.5mA, and they integrate 512KB of Flash and 144KB of SRAM. The series offers various digital communication interfaces and analog interface resources, and includes over 10 cryptographic algorithm hardware acceleration engines. It supports storage encryption, user partition protection, secure boot, and other security features. These MCUs are suitable for a wide range of wireless connectivity applications.

The N32WB031 series Bluetooth chip is the next generation of high-performance, ultra-low-power Bluetooth 5.1 chips developed by NSING. It features a 32-bit Arm® Cortex®-M0 core with a maximum operating frequency of 64 MHz, and integrates 48 KB SRAM and 256/512 KB Flash on-chip. The chip includes an advanced BLE 5.1 RF transceiver, compliant with the Bluetooth BLE 5.1 specification. It can be configured for standard 1 Mbps BLE mode, 2 Mbps enhanced BLE mode, 125 Kbps BLE long-range mode (S8), and 500 Kbps BLE long-range mode (S2). It supports AoA (Angle of Arrival) and AoD (Angle of Departure), RSSI (Received Signal Strength Indicator), both master and slave roles, multiple connections, extended packet length, KEYSCAN, IRC, 10-bit 1.33 Msps ADC (configurable to 16-bit 16 Ksps), analog MIC input, PGA amplification, and a variety of peripherals including basic, general, and advanced timers, RTC, WWDG, IWDG, LPUART, USART, SPI, and I2C.